US Patent 10692824 Radar module with wafer level package and underfill
Patent 10692824 was granted and assigned to Infineon Technologies on June, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 29, 2018
0
Date of Patent
June 23, 2020
0
Patent Applicant
Patent Application Number
16173702
0
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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