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US Patent 10707050 System and method to detect glitches
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Current Assignee
Varian Semiconductor Equipment Associates
Date Filed
July 26, 2018
Date of Patent
July 7, 2020
Patent Applicant
Varian Semiconductor Equipment Associates
Patent Application Number
16046159
Patent Citations Received
US Patent 11469208 Method of manufacturing semiconductor package structure
US Patent 10886263 Stacked semiconductor package assemblies including double sided redistribution layers
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10707050
Patent Primary Examiner
Eliza W Osenbaugh-Stewart
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