Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10707177 Thermal interface material having different thicknesses in packages

Patent 10707177 was granted and assigned to Taiwan Semiconductor Manufacturing Company on July, 2020 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Date Filed
July 30, 2018
Date of Patent
July 7, 2020
Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent Application Number
16049015
Patent Citations Received
‌
US Patent 12027435 Packages including multiple encapsulated substrate blocks and overlapping redistribution structures
0
‌
US Patent 11282759 Chip package structure having warpage control and method of forming the same
‌
US Patent 11842935 Method for forming a reconstructed package substrate comprising substrates blocks
0
‌
US Patent 12002780 Package structure including a base and a lid disposed over the base and method of forming the package structure
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10707177
Patent Primary Examiner
‌
Allen L Parker

Find more entities like US Patent 10707177 Thermal interface material having different thicknesses in packages

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo