US Patent 10714437 Fan-out semiconductor package

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Is a

Patent

Patent attributes

Patent Applicant

Samsung

Current Assignee

Samsung

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10714437

Date of Patent

July 14, 2020

Patent Application Number

15905062

Date Filed

February 26, 2018

Patent Citations

‌

US Patent 10042772 Dynamic structural management of a distributed caching infrastructure

‌

US Patent 10026681 Fan-out semiconductor package

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US Patent 10083929 Fan-out semiconductor package

Patent Primary Examiner

‌

Alexander O Williams

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