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US Patent 10720417 Thermally enhanced fully molded fan-out module

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Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

July 21, 2020

Patent Application Number

15977973

Date Filed

May 11, 2018

Patent Citations Received

0

US Patent 11375317 Manufacturing method for multiple MEMS sound transducers

US Patent 11982853 Optoelectronic package and method of manufacturing the same

0

US Patent 11502060 Microelectronics package with enhanced thermal dissipation

US Patent 10811358 Hybrid interposer and semiconductor package including the same

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