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US Patent 10727119 Process integration approach of selective tungsten via fill
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Edits on 21 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 21 May, 2023
Edits made to:
Infobox
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-1
properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10727119
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0
Edits on 6 Apr, 2023
"Entity importer update"
Golden AI
edited on 6 Apr, 2023
Infobox
Is a
Patent
0
Patent Applicant
Applied Materials
0
Current Assignee
Applied Materials
0
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10727119
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Date of Patent
July 28, 2020
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Patent Application Number
16252100
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Date Filed
January 18, 2019
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10727119
0
Patent Citations
US Patent 10014213 Selective bottom-up metal feature filling for interconnects
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US Patent 10157786 Selective formation of metallic films on metallic surfaces
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US Patent 10256144 Process integration approach of selective tungsten via fill
0
Patent Primary Examiner
Long Pham
0
"update citations for inverse infoboxes"
Golden AI
edited on 6 Apr, 2023
Infobox
Patent Citations
US Patent 10256144 Process integration approach of selective tungsten via fill
0
Edits on 3 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 3 Apr, 2023
Infobox
Patent Citations
US Patent 10157786 Selective formation of metallic films on metallic surfaces
0
Edits on 26 Sep, 2022
"Entity importer update"
Golden AI
edited on 26 Sep, 2022
Infobox
Is a
Patent
0
Patent Applicant
Applied Materials
0
Current Assignee
Applied Materials
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10727119
0
Date of Patent
July 28, 2020
0
Patent Application Number
16252100
0
Date Filed
January 18, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10727119
0
Patent Citations
US Patent 10014213 Selective bottom-up metal feature filling for interconnects
0
US Patent 10157786 Selective formation of metallic films on metallic surfaces
0
US Patent 10256144 Process integration approach of selective tungsten via fill
0
Patent Primary Examiner
Long Pham
0
Edits on 8 Jun, 2022
"Entity importer update"
Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10727119
Edits on 5 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 5 Feb, 2022
Edits made to:
Infobox
(
+12
properties)
US Patent 10727119 Process integration approach of selective tungsten via fill
Infobox
Is a
Patent
Patent applicant
Applied Materials
Current assignee
Applied Materials
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10727119
Date of patent
July 28, 2020
Patent application number
16252100
Date Filed
January 18, 2019
Patent citations
US Patent 10014213 Selective bottom-up metal feature filling for interconnects
US Patent 10157786 Selective formation of metallic films on metallic surfaces
US Patent 10256144 Process integration approach of selective tungsten via fill
Patent primary examiner
Long Pham
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