US Patent 10735176 High-speed data recovery with minimal clock generation and recovery

US Patent 11855056 Low cost solution for 2.5D and 3D packaging using USR chiplets

US Patent 11855043 Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates

US Patent 11893242 Multi-chip module (MCM) with multi-port unified memory

US Patent 11841815 Chiplet gearbox for low-cost multi-chip module applications

US Patent 11842986 Multi-chip module (MCM) with interface adapter circuitry