US Patent 10750639 Cooling memory modules

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Is a

Patent

Patent attributes

Patent Applicant

Hewlett Packard Enterprise

Current Assignee

Hewlett Packard Enterprise

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10750639

Date of Patent

August 18, 2020

Patent Application Number

16196372

Date Filed

November 20, 2018

Patent Citations

‌

US Patent 10499488 Liquid-cooled integrated circuit system

Patent Citations Received

‌

US Patent 11246236 Liquid cooling jacket, liquid cooling system, and electronic device

Patent Primary Examiner

‌

Jayprakash N. Gandhi

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