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US Patent 10763256 Integrated circuit device and method of fabricating the same

Patent 10763256 was granted and assigned to Samsung on September, 2020 by the United States Patent and Trademark Office.

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Edits on 27 Sep, 2023
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edited on 27 Sep, 2023
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Patent Citations Received
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US Patent 11769769 Integrated circuit device and method of fabricating the same
Edits on 21 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10763256
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https://pdfpiw.uspto.gov/.piw?Docid=10763256
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 US Patent 10763256 Integrated circuit device and method of fabricating the same

Infobox
Is a
Patent
Patent
Current assignee
Samsung
Samsung
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10763256
Date of patent
September 1, 2020
Patent application number
16840322
Date Filed
April 3, 2020
Patent citations
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US Patent 10056289 Fabrication of vertical transport fin field effect transistors with a self-aligned separator and an isolation region with an air gap
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US Patent 10128240 Semiconductor device and method for fabricating the same
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US Patent 10141312 Semiconductor devices including insulating materials in fins
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US Patent 10153212 Semiconductor device including contact structure
Patent primary examiner
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Savitri Mulpuri

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