US Patent 10770479 Three-dimensional device and method of forming the same

Patent 10770479 was granted and assigned to Tokyo Electron on September, 2020 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Tokyo Electron

Current Assignee

Tokyo Electron

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10770479

Date of Patent

September 8, 2020

Patent Application Number

16357893

Date Filed

March 19, 2019

Patent Citations

‌

US Patent 10074573 CMOS nanowire structure

Patent Citations Received

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US Patent 11804436 Self-aligned buried power rail cap for semiconductor devices

Patent Primary Examiner

‌

Hsien-Ming Lee

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