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US Patent 10777453 Low resistivity films containing molybdenum

Patent 10777453 was granted and assigned to Lam Research on September, 2020 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12074029 Molybdenum deposition
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Patent Citations Received
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US Patent 11970776 Atomic layer deposition of metal films
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=107774530
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Patent Citations Received
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US Patent 11549175 Method of depositing tungsten and other metals in 3D NAND structures
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Patent citations received
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US Patent 11355345 Method for preventing line bending during metal fill process
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 US Patent 10777453 Low resistivity films containing molybdenum

Infobox
Is a
Patent
Patent
Patent applicant
Lam Research
Lam Research
Current assignee
Lam Research
Lam Research
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10777453
Date of patent
September 15, 2020
Patent application number
16676169
Date Filed
November 6, 2019
Patent citations
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US Patent 10283404 Selective deposition of WCN barrier/adhesion layer for interconnect
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US Patent 10510590 Low resistivity films containing molybdenum
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US Patent 10573522 Method for preventing line bending during metal fill process
Patent primary examiner
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David S. Blum

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