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US Patent 10784086 Cobalt etch back

Patent 10784086 was granted and assigned to Lam Research on September, 2020 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Lam Research

Current Assignee

Lam Research

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

107840860

Date of Patent

September 22, 2020

Patent Application Number

158249870

Date Filed

November 28, 2017

Patent Citations

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US Patent 10186426 Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)

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US Patent 10096487 Atomic layer etching of tungsten and other metals

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US Patent 10374144 Dry plasma etch method to pattern MRAM stack

Patent Citations Received

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US Patent 11450513 Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials

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US Patent 10998187 Selective deposition with atomic layer etch reset

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US Patent 11069535 Atomic layer etch of tungsten for enhanced tungsten deposition fill

Patent Primary Examiner

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Jeffrie R. Lund

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