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US Patent 10790162 Integrated circuit package and method

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Edits on 22 Jul, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10790162
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Patent Citations Received
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US Patent 11393795 Semiconductor package
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Patent Citations Received
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US Patent D920266 Integrated circuit package
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Edits on 24 Sep, 2022
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Patent Citations Received
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US Patent 11393795 Semiconductor package
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Edits on 22 Sep, 2022
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edited on 22 Sep, 2022
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Patent Citations Received
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US Patent D920266 Integrated circuit package
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"update citations for inverse infoboxes"
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edited on 20 Jul, 2022
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Patent citations received
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US Patent 11393795 Semiconductor package
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edited on 9 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10790162
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edited on 10 Mar, 2022
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Patent citations received
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US Patent 11270960 Radio-frequency module having RF and front-end integrated circuits
Edits on 12 Feb, 2022
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edited on 12 Feb, 2022
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Patent citations received
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US Patent D920266 Integrated circuit package
"update inverses"
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edited on 12 Feb, 2022
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Patent citations received
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US Patent D920265 Integrated circuit package
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 US Patent 10790162 Integrated circuit package and method

Infobox
Is a
Patent
Patent
Patent applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Current assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10790162
Date of patent
September 29, 2020
Patent application number
16207850
Date Filed
December 3, 2018
Patent citations
‌
US Patent 10134711 Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same
Patent primary examiner
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Scott B. Geyer

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