US Patent 10790221 Through-hole electrode substrate
Patent 10790221 was granted and assigned to Dai Nippon Printing on September, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 15, 2020
0
Date of Patent
September 29, 2020
0
Patent Applicant
Patent Application Number
16743145
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Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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