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US Patent 10796913 Method for hybrid wafer-to-wafer bonding

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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 11984417 Semiconductor structure and manufacturing method thereof
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US Patent 11955445 Metal pads over TSV
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US Patent 11929347 Mixed exposure for large die
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US Patent 11804377 Method for preparing a surface for direct-bonding
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US Patent 11749645 TSV as pad
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1079691300
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
107969130
Date of Patent
October 6, 2020
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Patent Application Number
163300870
Date Filed
June 6, 2017
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=107969130
Patent Citations Received
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US Patent 11552041 Chemical mechanical polishing for hybrid bonding
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Patent Primary Examiner
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Nikolay K Yushin
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edited on 11 Jan, 2023
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Patent Citations Received
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US Patent 11552041 Chemical mechanical polishing for hybrid bonding
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Edits on 25 Sep, 2022
"Entity importer update"
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Golden AI
edited on 25 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
107969130
Date of Patent
October 6, 2020
0
Patent Application Number
163300870
Date Filed
June 6, 2017
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=107969130
Patent Primary Examiner
‌
Nikolay K Yushin
0
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10796913
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 US Patent 10796913 Method for hybrid wafer-to-wafer bonding

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10796913
Date of patent
October 6, 2020
Patent application number
16330087
Date Filed
June 6, 2017
Patent primary examiner
‌
Nikolay K Yushin

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