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US Patent 10804178 Integrated circuit package and method of forming same

Patent 10804178 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2020 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 11764192 Semiconductor package including underfill material layer and method of forming the same
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=108041780
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10804178
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 US Patent 10804178 Integrated circuit package and method of forming same

Infobox
Is a
Patent
Patent
Patent applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Current assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10804178
Date of patent
October 13, 2020
Patent application number
16697898
Date Filed
November 27, 2019
Patent citations
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US Patent 10157888 Integrated fan-out packages and methods of forming the same
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US Patent 10170341 Release film as isolation film in package
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US Patent 10504824 Integrated circuit package and method
Patent primary examiner
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George R Fourson, III

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