US Patent 10811274 Etching method and plasma processing apparatus
Patent 10811274 was granted and assigned to Tokyo Electron on October, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 7, 2018
Date of Patent
October 20, 2020
Patent Applicant
Patent Application Number
16212838
Patent Citations
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 10811274 Etching method and plasma processing apparatus
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
