US Patent 10811325 Self-healing semiconductor wafer processing

Patent 10811325 was granted and assigned to Applied Materials on October, 2020 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Applied Materials

Current Assignee

Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10811325

Date of Patent

October 20, 2020

Patent Application Number

15687343

Date Filed

August 25, 2017

Patent Citations

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US Patent 10203200 Analyzing root causes of process variation in scatterometry metrology

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US Patent 10242290 Method, system, and user interface for metrology target characterization

Patent Primary Examiner

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Allen L Parker

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