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US Patent 10811378 Electronic package and manufacturing method thereof
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Edits on 18 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 18 May, 2023
Edits made to:
Infobox
(
-1
properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10811378
0
Edits on 29 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 29 Apr, 2023
Infobox
Patent Citations
US Patent 10290530 Info structure with copper pillar having reversed profile
0
Edits on 25 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 25 Apr, 2023
Infobox
Patent Citations
US Patent 10535626 Structures and methods for low temperature bonding using nanoparticles
0
Edits on 5 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 5 Apr, 2023
Infobox
Patent Citations
US Patent 10340241 Chip-on-chip structure and methods of manufacture
0
Edits on 23 Sep, 2022
"Entity importer update"
Golden AI
edited on 23 Sep, 2022
Infobox
Is a
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10811378
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Date of Patent
October 20, 2020
0
Patent Application Number
16533751
0
Date Filed
August 6, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10811378
0
Patent Citations
US Patent 10290530 Info structure with copper pillar having reversed profile
0
US Patent 10331161 Power supply board
0
US Patent 10340241 Chip-on-chip structure and methods of manufacture
0
US Patent 10535626 Structures and methods for low temperature bonding using nanoparticles
0
US Patent 10699981 Non-vertical through-via in package
0
US Patent 10734346 Method of manufacturing chip-on-chip structure comprising sinterted pillars
0
Patent Primary Examiner
Victoria K. Hall
0
Edits on 17 Jun, 2022
"Entity importer update"
Golden AI
edited on 17 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10811378
Edits on 7 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 7 Feb, 2022
Edits made to:
Infobox
(
+13
properties)
US Patent 10811378 Electronic package and manufacturing method thereof
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10811378
Date of patent
October 20, 2020
Patent application number
16533751
Date Filed
August 6, 2019
Patent citations
US Patent 10290530 Info structure with copper pillar having reversed profile
US Patent 10331161 Power supply board
US Patent 10340241 Chip-on-chip structure and methods of manufacture
US Patent 10535626 Structures and methods for low temperature bonding using nanoparticles
US Patent 10699981 Non-vertical through-via in package
US Patent 10734346 Method of manufacturing chip-on-chip structure comprising sinterted pillars
Patent primary examiner
Victoria K. Hall
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