US Patent 10828726 SiC wafer producing method using ultrasonic wave
Patent 10828726 was granted and assigned to Disco Corporation on November, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 9, 2018
0
Date of Patent
November 10, 2020
0
Patent Applicant
Patent Application Number
15892660
0
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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