US Patent 10840129 Semiconductor package and method

Patent 10840129 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2020 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Applicant

Taiwan Semiconductor Manufacturing Company

Current Assignee

Taiwan Semiconductor Manufacturing Company

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

108401290

Date of Patent

November 17, 2020

Patent Application Number

167178810

Date Filed

December 17, 2019

Patent Citations

‌

US Patent 10515848 Semiconductor package and method

Patent Citations Received

‌

US Patent 11948930 Semiconductor package and method of manufacturing the same

Patent Primary Examiner

‌

Vu A Vu

No article content yet.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 10840129 Semiconductor package and method

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API