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US Patent 10840134 Interconnect structure and method
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Patent
Date Filed
April 22, 2019
Date of Patent
November 17, 2020
Patent Applicant
Taiwan Semiconductor Manufacturing Company
Patent Application Number
16391035
Patent Citations
US Patent 10522408 FinFET device and method of forming same
US Patent 10038095 V-shape recess profile for embedded source/drain epitaxy
Patent Citations Received
US Patent 12002712 Phase control in contact formation
0
US Patent 11410880 Phase control in contact formation
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10840134
Patent Primary Examiner
Thinh T Nguyen
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