US Patent 10840180 Production method for multilayer wiring board
Patent 10840180 was granted and assigned to Mitsui on November, 2020 by the United States Patent and Trademark Office.
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Patent Number
108401800
Date of Patent
November 17, 2020
0Patent Application Number
163398060
Date Filed
October 6, 2016
0Official Website
Patent Primary Examiner
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
108401800
Date of Patent
November 17, 2020
0Patent Application Number
163398060
Date Filed
October 6, 2016
0Official Website
Patent Primary Examiner
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US Patent 10840180 Production method for multilayer wiring board
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10840180
Date of patent
November 17, 2020
Patent application number
16339806
Date Filed
October 6, 2016
Patent primary examiner
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