US Patent 10843965 Silica molded bodies having low thermal conductivity
Patent 10843965 was granted and assigned to Wacker Chemie AG on November, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 9, 2016
0
Date of Patent
November 24, 2020
0
Patent Applicant
Patent Application Number
15754394
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 10843965 Silica molded bodies having low thermal conductivity
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
