US Patent 10847468 Semiconductor package including interposer

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Is a

Patent

Patent attributes

Patent Applicant

Samsung

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

108474680

Date of Patent

November 24, 2020

Patent Application Number

162993400

Date Filed

March 12, 2019

Patent Citations Received

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US Patent 12074140 System formed through package-in-package formation

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US Patent 11569216 Semiconductor package including stacked semiconductor chips and method for fabricating the semiconductor package

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US Patent 11387177 Package structure and method for forming the same

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US Patent 11469184 Semiconductor device and manufacturing method of the same

Patent Primary Examiner

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Tu-Tu V Ho

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