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US Patent 10852492 Techniques to combine two integrated photonic substrates

Patent 10852492 was granted and assigned to Acacia Communications on December, 2020 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Acacia Communications

Current Assignee

Acacia Communications

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

108524921

Date of Patent

December 1, 2020

Patent Application Number

149268681

Date Filed

October 29, 2015

Patent Citations Received

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US Patent 11561346 Tunable echelle grating

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US Patent 12089931 Optical sensor for skin-contact detection and physiological parameter measurement at wearable electronic device

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US Patent 11500154 Asymmetric optical power splitting system and method

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US Patent 11506535 Diffraction grating design

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US Patent 11525967 Photonics integrated circuit architecture

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US Patent 11525958 Off-cut wafer with a supported outcoupler

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US Patent 11552454 Integrated laser source

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Patent Primary Examiner

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Peter Radkowski

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