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US Patent 10854565 Chip package structure with bump
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Edits on 16 Oct, 2024
"update inverses"
Golden AI
edited on 16 Oct, 2024
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Patent Citations Received
US Patent 12119320 Chip package structure with bump
0
Edits on 13 Sep, 2023
"update inverses"
Golden AI
edited on 13 Sep, 2023
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+1
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Patent Citations Received
US Patent 11756931 Chip package structure with molding layer
Edits on 23 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 23 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10854565
Edits on 24 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 24 Apr, 2023
Infobox
Patent Citations Received
US Patent 11469215 Chip package structure with molding layer and method for forming the same
0
Edits on 29 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 29 Mar, 2023
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Patent Citations
US Patent 10083927 Chip package structure with bump
0
Edits on 22 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 22 Mar, 2023
Infobox
Patent Citations Received
US Patent 11410956 Chip package structure with bump
0
Edits on 12 Oct, 2022
"update inverses"
Golden AI
edited on 12 Oct, 2022
Edits made to:
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+1
properties)
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Patent Citations Received
US Patent 11469215 Chip package structure with molding layer and method for forming the same
0
Edits on 23 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 23 Sep, 2022
Infobox
Patent Citations Received
US Patent 11410956 Chip package structure with bump
0
Edits on 10 Aug, 2022
"update inverses"
Golden AI
edited on 10 Aug, 2022
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+1
properties)
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Patent citations received
US Patent 11410956 Chip package structure with bump
Edits on 17 Jun, 2022
"Entity importer update"
Golden AI
edited on 17 Jun, 2022
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+1
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10854565
Edits on 8 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 8 Feb, 2022
Edits made to:
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US Patent 10854565 Chip package structure with bump
Infobox
Is a
Patent
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10854565
Date of patent
December 1, 2020
Patent application number
16137774
Date Filed
September 21, 2018
Patent citations
US Patent 10083927 Chip package structure with bump
Patent primary examiner
Alexander G Ghyka
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