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US Patent 10861815 High density substrate routing in package
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Edits on 21 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 21 May, 2023
Edits made to:
Infobox
(
-1
properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10861815
0
0
Edits on 25 Apr, 2023
"Entity importer update"
Golden AI
edited on 25 Apr, 2023
Infobox
Is a
Patent
0
Patent Applicant
Intel
0
Current Assignee
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10861815
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Date of Patent
December 8, 2020
0
Patent Application Number
16561965
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Date Filed
September 5, 2019
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10861815
0
Patent Citations
US Patent 10199346 High density substrate routing in package
0
US Patent 10366951 Localized high density substrate routing
0
Patent Primary Examiner
S. V. Clark
0
Edits on 23 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 23 Apr, 2023
Infobox
Patent Citations
US Patent 10366951 Localized high density substrate routing
0
Edits on 27 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 27 Sep, 2022
Infobox
Patent Citations
US Patent 10199346 High density substrate routing in package
0
Edits on 25 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 25 Sep, 2022
Infobox
Patent Citations
US Patent 10366951 Localized high density substrate routing
0
Edits on 23 Sep, 2022
"Entity importer update"
Golden AI
edited on 23 Sep, 2022
Infobox
Is a
Patent
0
Patent Applicant
Intel
0
Current Assignee
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10861815
0
Date of Patent
December 8, 2020
0
Patent Application Number
16561965
0
Date Filed
September 5, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10861815
0
Patent Citations
US Patent 10199346 High density substrate routing in package
0
US Patent 10366951 Localized high density substrate routing
0
Patent Primary Examiner
S. V. Clark
0
Edits on 17 Jun, 2022
"Entity importer update"
Golden AI
edited on 17 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10861815
Edits on 8 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 8 Feb, 2022
Edits made to:
Infobox
(
+11
properties)
US Patent 10861815 High density substrate routing in package
Infobox
Is a
Patent
Patent applicant
Intel
Current assignee
Intel
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10861815
Date of patent
December 8, 2020
Patent application number
16561965
Date Filed
September 5, 2019
Patent citations
US Patent 10199346 High density substrate routing in package
US Patent 10366951 Localized high density substrate routing
Patent primary examiner
S. V. Clark
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