US Patent 10867874 Semiconductor device and method

Patent 10867874 was granted and assigned to Taiwan Semiconductor Manufacturing Company on December, 2020 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Taiwan Semiconductor Manufacturing Company

Current Assignee

Taiwan Semiconductor Manufacturing Company

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

108678740

Date of Patent

December 15, 2020

Patent Application Number

162531090

Date Filed

January 21, 2019

Patent Citations Received

‌

US Patent 12002799 Die stacking structure and method forming same

Patent Primary Examiner

‌

Zandra V Smtih

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