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US Patent 10867959 Integrated circuit packaging method and integrated packaged circuit

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United States Patent and Trademark Office

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Patent Number

Date of Patent

December 15, 2020

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Patent Application Number

164648800

Date Filed

November 30, 2016

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Patent Citations

US Patent 10615151 Integrated circuit multichip stacked packaging structure and method

Patent Primary Examiner

J. E. Schoenholtz

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