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US Patent 10872852 Wafer level package utilizing molded interposer

Patent 10872852 was granted and assigned to Micron Technology on December, 2020 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Micron Technology

Current Assignee

Micron Technology

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10872852

Date of Patent

December 22, 2020

Patent Application Number

15291086

Date Filed

October 12, 2016

Patent Citations Received

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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics

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US Patent 12113056 Stacked dies and methods for forming bonded structures

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US Patent 11031352 Routing design of dummy metal cap and redistribution line

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US Patent 11710693 Wafer level package utilizing molded interposer

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US Patent 11916054 Stacked devices and methods of fabrication

Patent Primary Examiner

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Dale E Page

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