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US Patent 10872854 Electro-optical package and method of fabrication
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Date Filed
April 24, 2019
Date of Patent
December 22, 2020
Patent Application Number
16393763
Patent Citations Received
US Patent 11982853 Optoelectronic package and method of manufacturing the same
0
US Patent 11443998 Electronic assembly including optical modules
US Patent 12130485 Stacked-dies optically bridged multicomponent package
0
US Patent 12124095 Optical multi-die interconnect bridge with optical interface
0
US Patent 11835777 Optical multi-die interconnect bridge (OMIB)
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10872854
Patent Primary Examiner
Jerry Rahll
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