US Patent 10879075 Wrap-around contact plug and method manufacturing same
Patent 10879075 was granted and assigned to Taiwan Semiconductor Manufacturing Company on December, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 27, 2020
Date of Patent
December 29, 2020
Patent Applicant
Patent Application Number
16859125
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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