Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wen-Long Lu0
Date of Patent
January 5, 2021
0Patent Application Number
162646070
Date Filed
January 31, 2019
0Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The semiconductor device is disposed on the substrate. The semiconductor device includes a first lateral surface. The underfill is disposed between the substrate and the semiconductor device. The underfill includes a first lateral surface. The first lateral surface of the underfill and the first lateral surface of the semiconductor device are substantially coplanar.
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