US Patent 10886252 Method of bonding semiconductor substrates
Patent 10886252 was granted and assigned to IMEC on January, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
0
Date Filed
February 28, 2018
0
Date of Patent
January 5, 2021
0
Patent Applicant
0
Patent Application Number
15908641
0
Patent Inventor Names
Robert Miller
0
Soon-Wook Kim
0
Eric Beyne
0
Erik Sleeckx
0
Gerald Peter Beyer
0
Lan Peng
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 10886252 Method of bonding semiconductor substrates
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
