A light emitting device including a first light emitting part including a first ohmic layer, a second light emitting part and including a second ohmic layer, a third light emitting part including first and second metal patterns respectively contacting semiconductor layers thereof, a first pad electrically coupled with the first ohmic layer, a second pad electrically coupled with the second ohmic layer, a third pad electrically coupled with the first metal pattern, a common pad electrically coupled with a semiconductor layer of the first and second light emitting parts and the second metal pattern, and a via structure electrically coupling the second metal pattern and the common pad between the second metal pattern and the common pad, in which the second metal pattern has a first portion contacting the first via structure and a second portion contacting the semiconductor layer of the third light emitting part.