US Patent 10886694 Hermetic capsule and method
Patent 10886694 was granted and assigned to Lightwave Logic on January, 2021 by the United States Patent and Trademark Office.
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Patent abstract
A hermetic capsule including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed thereon and a semiconductor/metal lid. The semiconductor/metal lid sealed to the semiconductor/metal base by metallization so as to form a chamber including all of the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and all sensitive components from the ambient. External access to the sensitive semiconductor/polymer electrical and optical components is provided through a metallization.
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Patent Inventor Names
Michael Lebby0
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Official Website
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US Patent 10886694 Hermetic capsule and method
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Patent applicant
Current assignee
Patent jurisdiction
Patent number
10886694
Date of patent
January 5, 2021
Patent application number
16714754
Date Filed
December 15, 2019
Patent citations
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