US Patent 10887580 Three-dimensional imaging for semiconductor wafer inspection
Patent 10887580 was granted and assigned to KLA-Tencor on January, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 22, 2017
Date of Patent
January 5, 2021
Patent Applicant
Patent Application Number
15683077
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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