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US Patent 10890502 Pressure sensor device
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Patent
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Date Filed
August 27, 2018
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Date of Patent
January 12, 2021
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Patent Application Number
16114156
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Patent Citations
US Patent 10006825 Pressure sensor including a structure for controlling an adhesive layer resistant to temperature variations
US Patent 10717645 Exposed-die mold package for a sensor and method for encapsulating a sensor that interacts with the environment
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Patent Citations Received
US Patent 11839451 Sensing structure for pulse-wave velocity measurement
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US Patent 11624667 Interface pressure sensor system for electronic device
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US Patent 11346738 Pressure sensor having a cap being attached to the substrate surface with an adhesive
US Patent 11839450 Pressure sensor module for wearable applanation tonometer
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Patent Inventor Names
Shojiro Kurimata
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Shuntaro Miyake
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10890502
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Patent Primary Examiner
Jamel E Williams
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