Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 12, 2021
Patent Application Number
16717617
Date Filed
December 17, 2019
Patent Citations Received
Patent Primary Examiner
Patent abstract
A high frequency power circuit module includes an electronic circuit substrate having a bending section, a high frequency power circuit formed on the electronic circuit substrate, a battery connected to the high frequency power circuit, and a magnetic material sheet having an area larger than that of the battery. The battery is covered with the magnetic material sheet in a state in which the electronic circuit substrate is bent at a bending section. The high frequency power circuit, the battery, and the magnetic material sheet are thermally coupled to each other by a resin sealing member, which is a material having a smaller thermal resistance than that of air.
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