Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 19, 2021
Patent Application Number
16749179
Date Filed
January 22, 2020
Patent Citations Received
Patent Primary Examiner
Patent abstract
Provided is a printed wiring board comprising: a substrate; a conductive layer including a land and a wiring and formed on a surface of the substrate, the wiring having a width smaller than the land and drawn from the land; and an insulating layer formed on the conductive layer. The insulating layer has an opening corresponding to a position of the land, and an edge of the opening runs above the land and above one of edges in a width direction of the wiring.
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