Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 26, 2021
Patent Application Number
16682142
Date Filed
November 13, 2019
Patent Citations Received
Patent Primary Examiner
Patent abstract
Back end of line metallization structures and processes of fabricating the metallization structures generally include one or more metal filled via structures within a dielectric layer of an interconnect level, wherein at least one of the metal filled via structures includes a bulk metal and a metal alloy overlaying the bulk metal, wherein the bulk metal and metal alloy filled via is coupled to an active circuit.
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