Patent attributes
A method of processing a CMC component includes preparing a fiber preform having a predetermined shape, and positioning the fiber preform with tooling having holes facing one or more surfaces of the fiber preform. After the positioning, a clamping pressure is applied to the tooling to force portions of the one or more surfaces of the fiber preform into the holes, thereby forming protruded regions of the fiber preform. During the application of the clamping pressure, the fiber preform is exposed to gaseous reagents at an elevated temperature, and a matrix material is deposited on the fiber preform to form a rigidized preform including surface protrusions. After removing the tooling, the rigidized preform is infiltrated with a melt for densification, and a CMC component having surface bumps is formed. When the CMC component is assembled with a metal component, the surface bumps may reduce diffusion at high temperatures.
