US Patent 10910329 Semiconductor package device and method of manufacturing the same

The disclosure relates to a semiconductor package device. The semiconductor package device includes a substrate, a waveguide component, a package body, a first dielectric layer, an antenna pattern, and an antenna feeding layer. The waveguide component is on the substrate. The package body is on the substrate and encapsulates the waveguide component. The first dielectric layer is on the package body and has a first surface and a second surface adjacent to the package body and opposite to the first surface. The antenna pattern is on the first surface of the first dielectric layer. The antenna feeding layer is on the second surface of the first dielectric layer.