Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 2, 2021
Patent Application Number
16212790
Date Filed
December 7, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic device includes a substrate semiconductor wafer with semiconductor portions separated from one another by through-passages. Electronic circuits and a dielectric layer with a network of electrical connections are formed at a front face of the substrate semiconductor wafer. Electrically conductive fillings are contained within the through-passages and are connected to the network of electrical connections. Interior dielectric layers for anti-diffusion protection are provided in the through-passages between the electrically conductive fillings and the semiconductor portions. Back side dielectric layers are joined to the interior dielectric layers.
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