Patent attributes
An integrated power module includes a base case defining an internal manifold, and an interface surface comprising a plurality of inlet apertures and outlet apertures each in fluid communication with the internal manifold. The integrated power module also includes a plurality of power cards fastened to the base case and in direct contact with the interface surface. Each of the power cards has a bottom cover defining an inner surface and an outer surface, a base plate sealed with the bottom cover, a substrate secured on the base plate such that the base plate is between the substrate and bottom cover, and an integrated circuit disposed on the substrate. The inner surface and the base plate define a cooling channel configured to direct coolant from one of the inlet apertures, through the power card, and to one of the outlet apertures.