Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 16, 2021
Patent Application Number
16400632
Date Filed
May 1, 2019
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present disclosure describes composite siding panels with a structure that reduces dimpling. The siding panel comprises a backing member and a siding member that are joined by an adhesive layer. The adhesive layer may be made with fingers extending from its sides, or may be made with an adhesive that has an elongation factor of at least 1000%. These reduce dimpling.
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