US Patent 10921536 Heat sink for optical transceiver

An electronics module is provided. The electronics module includes a housing at least partially enclosing a first printed circuit board configured to couple the electronics module to a connector attached to a second printed circuit board. The electronics module includes a first heat sink disposed along a first surface of the housing and a second heat sink disposed along a second surface of the housing. One or more notches or apertures of the first printed circuit board are proximate to the connector thereby enabling an airflow through the second heat sink along the second surface of the housing to exhaust over a surface of the connector with an airflow through the first heat sink.