US Patent 10925177 Heat dissipation in an electronic circuit and method
Patent 10925177 was granted and assigned to comet (company) on February, 2021 by the United States Patent and Trademark Office.
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Patent abstract
An electronic circuitry module and a method of potting an electronic circuit are provided. The electronic circuit module includes at least one heat generating electronic component and is potted in a potting material. Additionally, a cooling circuit is potted in the potting material. The cooling circuit includes an inlet and an outlet for flow of cooling liquid therebetween.
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Patent Inventor Names
Ulrich Hansen0
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Official Website
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
109251770
Date of Patent
February 16, 2021
0Patent Application Number
165437220
Date Filed
August 19, 2019
0Official Website
Patent Citations
Patent Primary Examiner
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US Patent 10925177 Heat dissipation in an electronic circuit and method
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10925177
Date of patent
February 16, 2021
Patent application number
16543722
Date Filed
August 19, 2019
Patent citations
Patent primary examiner
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