Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yan Li0
Gokul Kumar0
Hem Takiar0
Michael Mostovoy0
Emilio Yero0
Date of Patent
February 23, 2021
Patent Application Number
16722278
Date Filed
December 20, 2019
Patent Primary Examiner
Patent abstract
A semiconductor device is disclosed including an integrated memory module. The integrated memory module may include a pair of semiconductor die, which together, operate as a single, integrated flash memory. In one example, the first die may include the memory cell array and the second die may include the logic circuit such as CMOS integrated circuits. In one example, the second die may be flip-chip bonded to the first die. The flip-chip bond pads on the first and second dies may be made small, with a small pitch, to allow a large number of electrical interconnections between the first and second semiconductor dies.
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